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pcb supplier
Technical date:Surface coating: gold platting , H.A.L, immersion tin, immersion gold, OSP, lead free HAL, immersion silver.Used material: FR4,CEM3,CEM1Max layer: 8 layersMaximum b ... |
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pcb manufacturer
Technical date:Surface coating: gold platting , H.A.L, immersion tin, immersion gold, OSP, lead free HAL, immersion silver.Used material: FR4,CEM3,CEM1Max layer: 8 layersMaximum b ... |
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pcb supplier
Technical date:Surface coating: gold platting , H.A.L, immersion tin, immersion gold, OSP, lead free HAL, immersion silver.Used material: FR4,CEM3,CEM1Max layer: 8 layersMaximum b ... |
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pcb manufacturer
technical data:Surface disposition:gold platting,H.A.L,immersion tin,immersion gold,OSP,gymno-copper.Max-layer:10Max-process size:53cm*48cmProcessed-board thickness:0.4mm-3.2mmUse ... |
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pcb manufacturer
Technical date:Surface coating: gold platting , H.A.L, immersion tin, immersion gold, OSP, lead free HAL, immersion silver.Used material: FR4,CEM3,CEM1Max layer: 8 layersMaximum b ... |
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