technical data:

Surface disposition:gold platting,H.A.L,immersion tin,immersion gold,OSP,gymno-copper.

Max-layer:10

Max-process size:53cm*48cm

Processed-board thickness:0.4mm-3.2mm

Used base material:FR--4,CEM--3,CEM—1

Sequence skill :min hole size 0.30mm

                         Min line width  0.10mm

                Min line space 0.10mm

double-sided pcb, multilayer pcb which are with gold-flash, H.A.L.S, OSP, immersion gold, immersion tin and so on.