Technical data:

Surface coating: gold platting , H.A.L, immersion tin, immersion gold, OSP, lead free HAL, immersion silver.

Used material: FR4,CEM3,CEM1

Max layer: 8 layers

Maximum board size: 20inch*24inch      500mm*600mm

Minimum board thickness(outer): 12 mil   0.30 mm   2 L

                        24 mil   0.60 mm   4 L

                          48 mil   1.20 mm   6 L

                          64 mil   1.60 mm   8 L

Minimum board thickness(inner): 12 mil    0.30 mm

Maximum aspect ratio:  8：1      8：1

Minimum SMD spacing: 4 mil     0.1mm

Minimum finished hole size:  8 mil  0.2mm

Layer count: 2-8 L

Minimum trace space/width: 4mil   0.1mm

Multilayer registration accuracy: ± 3 mil   ±0.075mm

Accuracy of outline:  ± 4 mil   ±0.1m

Maximum copper weight: 3OZ  

Control impendence: 10％

Blind/buried via: Y

Relative compliance: ISO9001:2000，ISO/TS16949:2002，ISO14001:2004，UL